Organization profile

Introduction / mission

Our goal is to create constructive design trajectories for electronic systems that lead to high-quality, cost-effective systems with predictable properties (functionality, timing, reliability, power dissipation, cost).

Highlighted phrase

Designing better ways to design better electronics

Organisational profile

Electronic systems are everywhere. They closely interact with the physical systems they are embedded in, with human users, and with other systems connected in networks. Electronic systems are how we are going to create a smart society – if we can solve the societal challenges of reliability, miniaturization and reduction of power dissipation. The Electronic Systems (ES) research group aims to provide a scientific basis for design trajectories for electronic systems, from function to realization, and to do so in collaboration with industry.

The type of systems we are developing trajectories for include circuits, processors, systems-on-chip (SoC), embedded systems, cyber-physical systems (CPS) and networked systems.

The ES research program targets the design of next generations of electronic systems. It is organized in three subprograms that look at the challenges from the perspectives of engineering, systems and circuits. Together, this allows an integral approach.

The model-driven engineering subprogram tackles the design challenges for emerging electronic systems. The smart electronic systems subprogram targets architectures, systems software and algorithms that adapt to changing conditions to satisfy application requirements with minimal costs. The digital nanoelectronics subprogram targets nano-scale integration and integrated circuits with controlled reliability, performance and power dissipation properties.

It is our goal to transfer our research results to industry and other non-academic partners through close, direct collaboration, such as staff exchanges. We also participate in collaborations with research institutes and have made high-impact toolsets freely available.

Fingerprint Dive into the research topics where Electronic Systems is active. These topic labels come from the works of this organisation's members. Together they form a unique fingerprint.

Data storage equipment Engineering & Materials Science

Embedded systems Engineering & Materials Science

Throughput Engineering & Materials Science

Scheduling Engineering & Materials Science

Field programmable gate arrays (FPGA) Engineering & Materials Science

Hardware Engineering & Materials Science

Controllers Engineering & Materials Science

Communication Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Profiles

Hadi Ahmadi Balef, MSc

h.ahmadi.balef@tue.nl

Department of Electrical Engineering, Electronic Systems - University Researcher

Person: OWP : University Teacher / Researcher

Roohallah Azarmi, MSc

r.azarmi@tue.nl

Department of Electrical Engineering, Electronic Systems - Doctoral Candidate

Person: Prom. : doctoral candidate (PhD)

Alexios Balatsoukas Stimming

a.k.balatsoukas.stimming@tue.nl

Department of Electrical Engineering, Electronic Systems - Assistant Professor

Person: UD : Assistant Professor

Research Output 1976 2020

SoC design of a reconfigurable approximate low power digital baseband

Erdin, C., 6 Sep 2020, (Accepted/In press) Eindhoven: Technische Universiteit Eindhoven.

Research output: Thesis › Pd Eng Thesis

3D design‐for‐test architecture

Marinissen, E. J., Konijnenburg, M., Verbree, J., Chi, C-C., Deutsch, S., Papameletis, C., Burgherr, T., Shibin, K., Keller, B. L., Chickermane, V. & Goel, S. K., 8 Feb 2019, Handbook of 3D integration: volume 4: design, test, and thermal management. Franzon, P. D., Marinissen, E. J. & Bakir, M. S. (eds.). Weinheim: Wiley-VCH Verlag, p. 253-280 28 p.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic › peer-review

Hierarchical systems

Data compression

Networks (circuits)

Testing

System-on-chip

3D-integrated multi-sensor demonstrator system for environmental monitoring

Kock, A., Wimmer-Teubenbacher, R., Sosada-Ludwikovska, F., Rohracher, K., Wachmann, E., Herold, M., van Welden, T., Min Kim, J., Ali, Z., Poenninger, A., Stahl-Offergeld, M., Hohe, H. P., Lorenz, J., Erlbacher, T., Dolmans, G., Offermans, P., Vandecasteele, M., Yurchenko, O., Von Sicard, O., Pohle, R. & 11 others, Udrea, F., Falco, C., Flandre, D., Bol, D., Comini, E., Zappa, D., Gardner, J., Cole, M., Theunis, J., Peters, J. & Baldwin, A., 1 Jun 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Piscataway: Institute of Electrical and Electronics Engineers, p. 1136-1139 4 p. 8808418

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Sensor data fusion

Environmental Monitoring

environmental monitoring

Sensor

Monitoring

Equipment

Electronic Systems

S. Stuijk (Manager)

Electronic Systems

Facility/equipment: Research lab

Prizes

Best 3D Track Paper at International Wafer-Level Packaging Conference 2018

Arnita Podpod (Recipient), Dimitrios Velenis (Recipient), Alain Phommahaxay (Recipient), Pieter Bex (Recipient), Ferenc Fodor (Recipient), Erik Jan Marinissen (Recipient), Kenneth June Rebibis (Recipient), Andy Miller (Recipient), Gerald Beyer (Recipient) & Eric Beyne (Recipient), 25 Oct 2018

Prize: Other › Career, activity or publication related prizes (lifetime, best paper, poster etc.) › Scientific

Product Packaging