Organization profile

Introduction / mission

Our goal is to create constructive design trajectories for electronic systems that lead to high-quality, cost-effective systems with predictable properties (functionality, timing, reliability, power dissipation, cost).

Highlighted phrase

Designing better ways to design better electronics

Organisational profile

Electronic systems are everywhere. They closely interact with the physical systems they are embedded in, with human users, and with other systems connected in networks. Electronic systems are how we are going to create a smart society – if we can solve the societal challenges of reliability, miniaturization and reduction of power dissipation. The Electronic Systems (ES) research group aims to provide a scientific basis for design trajectories for electronic systems, from function to realization, and to do so in collaboration with industry.

The type of systems we are developing trajectories for include circuits, processors, systems-on-chip (SoC), embedded systems, cyber-physical systems (CPS) and networked systems.

The ES research program targets the design of next generations of electronic systems. It is organized in three subprograms that look at the challenges from the perspectives of engineering, systems and circuits. Together, this allows an integral approach.

The model-driven engineering subprogram tackles the design challenges for emerging electronic systems. The smart electronic systems subprogram targets architectures, systems software and algorithms that adapt to changing conditions to satisfy application requirements with minimal costs. The digital nanoelectronics subprogram targets nano-scale integration and integrated circuits with controlled reliability, performance and power dissipation properties.

It is our goal to transfer our research results to industry and other non-academic partners through close, direct collaboration, such as staff exchanges. We also participate in collaborations with research institutes and have made high-impact toolsets freely available.

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Profiles

Hadi Ahmadi Balef, MSc

h.ahmadi.balef@tue.nl

Department of Electrical Engineering, Electronic Systems - University Researcher

Person: OWP : University Teacher / Researcher

Roohallah Azarmi, MSc

r.azarmi@tue.nl

Department of Electrical Engineering, Electronic Systems - Doctoral Candidate

Person: Prom. : doctoral candidate (PhD)

Ali Banagozar, MSc

a.banagozar@tue.nl

Department of Electrical Engineering, Electronic Systems - Doctoral Candidate

Person: Prom. : doctoral candidate (PhD)

Research Output 1976 2019

3D design‐for‐test architecture

Marinissen, E. J., Konijnenburg, M., Verbree, J., Chi, C-C., Deutsch, S., Papameletis, C., Burgherr, T., Shibin, K., Keller, B. L., Chickermane, V. & Goel, S. K., 8 Feb 2019, Handbook of 3D integration: volume 4: design, test, and thermal management. Franzon, P. D., Marinissen, E. J. & Bakir, M. S. (eds.). Weinheim: Wiley-VCH Verlag, p. 253-280 28 p.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic › peer-review

Hierarchical systems

Data compression

Towers

Data storage equipment

Networks (circuits)

3D test: no longer a bottleneck!

Marinissen, E. J., 8 Mar 2019, In : 3DInCites: The First Decade. 1, 1, p. 21-26 + 60 7 p.

Research output: Contribution to journal › Article › Professional

Open Access

File

Data storage equipment

Semiconductor materials

Networks (circuits)

Testing

Three dimensional integrated circuits

A scenario-aware dataflow programming model with support for fault-tolerance

van Kampenhout, J. R., 25 Jun 2019, Eindhoven: Technische Universiteit Eindhoven. 148 p.

Research output: Thesis › Phd Thesis 1 (Research TU/e / Graduation TU/e) › Academic

Open Access

File

Equipment

Electronic Systems

Sander Stuijk (Manager)

Electronic Systems

Facility/equipment: Research lab

Prizes

Best 3D Track Paper at International Wafer-Level Packaging Conference 2018

Arnita Podpod (Recipient), Dimitrios Velenis (Recipient), Alain Phommahaxay (Recipient), Pieter Bex (Recipient), Ferenc Fodor (Recipient), Erik Jan Marinissen (Recipient), Kenneth June Rebibis (Recipient), Andy Miller (Recipient), Gerald Beyer (Recipient) & Eric Beyne (Recipient), 25 Oct 2018

Recognition: Other › Career, activity or publication related prizes (lifetime, best paper, poster etc.) › Scientific

Product Packaging