Waferbonder, AML

  • Partrick Bax (Manager)

Facility/equipment: Equipment

    Equipments Details


    With this machine it is possible to allign and subsequently bond wafers. Several types of bonds are possible, i.e. anodic, fusion, adhesive and eutectic. The maximum applicable voltage is 2.5 kV; the maximum applicable force is 15 kN. Bondig can be performed under vacuum or under controlled N2.


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