Mechanical / chemical polishing

  • Tjibbe de Vries (Manager)

Facility/equipment: Equipment

    Equipments Details

    Description

    Logitech LP50/Wafer Substrate Bonding Unit
    Photo associated with equipment - csm_sized_Logitec_mech_chem_polisher01_NH20150401_133359_ab0b13431d.jpg

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