WIPO PUBLISHES PATENT OF TECHNISCHE UNIVERSITEIT EINDHOVEN FOR "COMBINED 3D ASSEMBLY OF ASIC AND OPTICAL INTERCONNECT FOR COMPACT SWITCHES" (DUTCH INVENTORS)

Media coverage

• Title	WIPO PUBLISHES PATENT OF TECHNISCHE UNIVERSITEIT EINDHOVEN FOR "COMBINED 3D ASSEMBLY OF ASIC AND OPTICAL INTERCONNECT FOR COMPACT SWITCHES" (DUTCH INVENTORS)
  Media name/outlet	US Fed News
  Country/Territory	United States
  Date	5/11/18
  Persons	Oded Raz, Ripalta Stabile