WIPO PUBLISHES PATENT OF TECHNISCHE UNIVERSITEIT EINDHOVEN FOR "COMBINED 3D ASSEMBLY OF ASIC AND OPTICAL INTERCONNECT FOR COMPACT SWITCHES" (DUTCH INVENTORS)

Press/Media: Expert Comment

Period5 Nov 2018

Media coverage

1

Media coverage

  • TitleWIPO PUBLISHES PATENT OF TECHNISCHE UNIVERSITEIT EINDHOVEN FOR "COMBINED 3D ASSEMBLY OF ASIC AND OPTICAL INTERCONNECT FOR COMPACT SWITCHES" (DUTCH INVENTORS)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date5/11/18
    PersonsOded Raz, Ripalta Stabile
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