Media coverage
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Media coverage
Title Testing stacked dies in 3D integrated circuits .. Media name/outlet EE Times Europe Country/Territory United Kingdom Date 27/01/20 URL www.eenewseurope.com/news/testing-stacked-dies-3d-integrated-circuits Persons Erik Jan Marinissen Title New standard allows stacked dies in 3-D integrated circuits to connect with test equipment Media name/outlet Tech Xplore Country/Territory United States Date 27/01/20 URL https://techxplore.com/news/2020-01-standard-stacked-dies-d-circuits.html Persons Erik Jan Marinissen