Testing stacked dies in 3D integrated circuits ..

Media coverage

• Title	Testing stacked dies in 3D integrated circuits ..
  Media name/outlet	EE Times Europe
  Country	United Kingdom
  Date	27/01/20
  URL	www.eenewseurope.com/news/testing-stacked-dies-3d-integrated-circuits
  Persons	Erik Jan Marinissen

• Title	New standard allows stacked dies in 3-D integrated circuits to connect with test equipment
  Media name/outlet	Tech Xplore
  Country	United States
  Date	27/01/20
  URL	https://techxplore.com/news/2020-01-standard-stacked-dies-d-circuits.html
  Persons	Erik Jan Marinissen