Research Conducted at Fudan University Has Provided New Information about Engineering (Thermomechanical Oriented Reliability Enhancement of Si Mosfet Panel-level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network)

  • W. Chen

Press/Media: Expert Comment

Period18 Jul 2023

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Media coverage

  • TitleResearch Conducted at Fudan University Has Provided New Information about Engineering (Thermomechanical Oriented Reliability Enhancement of Si Mosfet Panel-level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network)
    Media name/outletNetwork Daily News
    Country/TerritoryUnited States
    Date18/07/23
    URLct.moreover.com/?a=51330163628&p=1gw&v=1&x=rsKKghRuG88t1ZxVIOO0hA
    PersonsW. Chen
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