New Solution for Testing Chips Prior to 3D Stacking

Press/Media: Research


Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful systems. Until now, it was impossible to probe the large arrays of fine-pitch micro-bumps on advanced chips before stacking. This had a negative effect on the compound yield (because of including faulty dies in the stack). Imec, together with FormFactor (formerly Cascade Microtech), has developed a unique fully-automatic system to probe these micro-bump arrays.

Period21 Aug 2017

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