Micro-scale pre-bond probe array automates tests for chips to be stacked

Press/Media: Expert Comment

Period	29 May 2017

Media coverage

Title	Micro-scale pre-bond probe array automates tests for chips to be stacked
Media name/outlet	EE Times Europe
Country/Territory	United Kingdom
Date	29/05/17
URL	www.eenewseurope.com/news/micro-scale-pre-bond-probe-array-automates-tests-chips-be-stacked
Persons	Erik Jan Marinissen