Belgium : New standard allows stacked dies in 3D integrated circuits to connect with test equipment

Press/Media: Expert Comment

Period1 Feb 2020

Media coverage

1

Media coverage

  • TitleBelgium : New standard allows stacked dies in 3D integrated circuits to connect with test equipment
    Media name/outletTendersInfo – News
    CountryIndia
    Date1/02/20
    PersonsErik Jan Marinissen