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IEEE 1838 Allows Test Access to Every Die in 3D IC Stack

Erik Jan Marinissen

28/01/20

1 item of Media coverage

Press/Media: Expert Comment

Stacked package standard for IEEE Xplore Digital Library

Erik Jan Marinissen

28/01/20

1 item of Media coverage

Press/Media: Expert Comment

The Virtual Arena: Educators Learn Their VR

Kevin A. Williams

28/01/20

2 items of Media coverage

Press/Media: Expert Comment

Helping low-income families with energy transition

Ioulia V. Ossokina

28/01/20

1 item of Media coverage

Press/Media: Expert Comment

1838-2019 test standard for 3D chips adds parallel operation

Erik Jan Marinissen

27/01/20

1 item of Media coverage

Press/Media: Expert Comment

Testing stacked dies in 3D integrated circuits ..

Erik Jan Marinissen

27/01/20

2 items of Media coverage

Press/Media: Expert Comment

Testing stacked dies in 3D integrated circuits

Erik Jan Marinissen

27/01/20

2 items of Media coverage

Press/Media: Expert Comment

All these robots need is light

Jaap M.J. den Toonder & Marina Pilz Da Cunha

25/01/20

1 item of Media coverage

Press/Media: Expert Comment