Activity: Talk or presentation types › Contributed talk › Scientific
Semiconductors switches used in motor drives are build up with several layers of different materials. These materials have different thermal-expansion coefficients and therefore cause a mechanical mismatch when the temperature changes. With cyclic variations in the temperature, the mechanical stresses are also cyclic and cause material fatigue in the long term. This process is called thermal cycling and reduces the lifetime of the semiconductor switches and also the motor drive. Over-dimensioning of power electronics is currently a viable solution to reach the required lifetime of a product. However, the drawbacks of over-dimensioning are the increased cost and size. Therefore, this project aims for a new power electronic topology which can reduce the thermal cycling in a more cost-effective way.